Accelerated life testing to validate product durability under extreme conditions
Environmental stress screening including thermal cycling, vibration, and humidity testing
Failure mode analysis to identify root causes and improve product reliability
Comprehensive reporting and recommendations for design and process improvements.
Environmental & Climatic Testing
- Temperature & Humidity Cycling
- Thermal Shock Testing
- Condensation & Freeze Thaw
- UV Exposure & Weathering
- Salt Spray / Fog Testing
- Sand & Dust Ingress
- Immersion & Rain Testing
Mechanical Stress Testing
- Vibration Testing (Sinusoidal & Random)
- Shock & Drop Testing
- Compression & Flexural Loading
- Connector Mating Cycles
- PCB Flexure Testing
Accelerated Life Testing
- HALT (Highly Accelerated Life Test)
- HASS (Highly Accelerated Stress Screening)
- Burn-in Testing
- Electromigration Studies
- Time-Dependent Dielectric Breakdown
Electrical Reliability Testing
- ESD Testing (HBM, MM, CDM)
- Latch-up Testing
- Power Cycling
- Current & Voltage Stress
- Electrostatic Discharge Susceptibility
- EMC / EMI Screening
Failure Analysis & Reporting
- Root Cause Analysis
- Failure Mode & Effect Analysis (FMEA)
- Weibull Analysis & MTBF Calculation
- FIT Rate Estimation
- Corrective Action Recommendations
Package & Interconnect Reliability
- Solder Joint Reliability
- Ball Shear & Wire Pull
- Die Shear Testing
- Intermetallic Growth Studies
- Package Cracking & Delamination
Product Qualification Testing
- JEDEC / IPC / MIL-STD Compliance
- Automotive AEC-Q100/Q101
- Medical Device Qualification
- Consumer Electronics Standards
- Telecom & Networking Standards
Process Reliability Validation
- Solder Paste & Flux Evaluation
- Wave Soldering Process Audit
- Reflow Profile Optimization
- Conformal Coating Adhesion
- Cleaning Process Validation
